上海配资

上海配资Chip Assembly/Testing

Chip Assembly/Testing

上海配资Design service Lab provide test chip engineer testing service based on wafer and package sort. The test chips include SOC, NVM memory/Library IP, high speed interface IP, Mixed signal and RF IP. The lab can also support DIP,COB, QFP quick package.

01

IP Testing

02

SoC Testing

03

Bonding Service

04

上海配资RF wafer level testing

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